The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Oct. 21, 2020
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
James Joseph Victory, Trabuco Canyon, CA (US);
Thomas Neyer, Munich, DE;
YunPeng Xiao, Shanghai, CN;
Hyeongwoo Jang, Bucheon-Si, KR;
Peter Dingenen, Oudenaarde, BE;
Vaclav Valenta, Brno, CZ;
Tirthajyoti Sarkar, Fremont, CA (US);
Mehrdad Baghaie Yazdi, Munich, DE;
Christopher Lawrence Rexer, Scottsdale, AZ (US);
Stanley Benczkowski, Bear Creek Township, PA (US);
Thierry Bordignon, Toulouse, FR;
Wai Lun Chu, Kowloon, HK;
Roman Sickaruk, Nezamyslice, CZ;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.