The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Dec. 17, 2019
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Gunnar Dietz, Nuremberg, DE;

Markus Mauersberger, Fürth, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/26 (2020.01); H03K 17/08 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2817 (2013.01); G01R 31/2619 (2013.01); G01R 31/2642 (2013.01); H03K 17/08 (2013.01); H03K 2017/0806 (2013.01);
Abstract

A method for determining the remaining usability of a semiconductor module in normal use. The semiconductor module is thermally coupled to a cooling device. A predefined electrical load is applied to the semiconductor module while predefined cooling is effected by the cooling device. A temperature of a semiconductor element of the semiconductor module is sensed at least for the predefined electrical load on the semiconductor module. The sensed temperature is compared with a comparison temperature in a first comparison. The comparison temperature is assigned to the predefined electrical load with the predefined cooling, and prediction data for the remaining usability of the semiconductor module in normal use up to a usability end are determined at least in accordance with the first comparison.


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