The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Mar. 06, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Shinji Hara, Tokyo, JP;
Naoki Ohta, Tokyo, JP;
Susumu Aoki, Tokyo, JP;
Eiji Komura, Tokyo, JP;
Akimasa Kaizu, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/22 (2006.01); H01C 7/06 (2006.01);
U.S. Cl.
CPC ...
G01K 7/22 (2013.01); H01C 7/06 (2013.01);
Abstract
A heat utilizing device is provided in which the thermal resistance of the wiring layer is increased while an increase in electric resistance of the wiring layer is limited. Heat utilizing device has thermistor whose electric resistance changes depending on temperature; and wiring layer that is connected to thermistor. A mean free path of phonons in wiring layer is smaller than a mean free path of phonons in an infinite medium that consists of a material of wiring layer.