The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Nov. 19, 2019
Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

Gary D. Roberge, Tolland, CT (US);

William J. Brindley, Hebron, CT (US);

Assignee:

Raytheon Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 24/04 (2006.01); B33Y 80/00 (2015.01); B22F 7/08 (2006.01); B22F 3/24 (2006.01); B22F 5/00 (2006.01); B22F 5/04 (2006.01); F01D 25/00 (2006.01); B22F 3/02 (2006.01);
U.S. Cl.
CPC ...
C23C 24/04 (2013.01); B22F 3/24 (2013.01); B22F 5/009 (2013.01); B22F 5/04 (2013.01); B22F 7/08 (2013.01); B33Y 80/00 (2014.12); F01D 25/005 (2013.01); B22F 3/02 (2013.01); B22F 2003/244 (2013.01); B22F 2003/247 (2013.01); B22F 2005/005 (2013.01); B22F 2998/10 (2013.01); F05D 2230/31 (2013.01);
Abstract

A method for forming a metallic structure having a secondary component includes positioning the secondary component on a main formation surface of a main tool, the main formation surface corresponding to a desired shape of a first layer of material. The method also includes depositing a layer of material on the secondary component and the main formation surface using a cold-spray technique such that the layer of material bonds to the secondary component. The method also includes removing the layer of material and the secondary component to form the metallic structure.


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