The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Mar. 30, 2020
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Janos Veres, San Jose, CA (US);

Timothy D. Stowe, Alameda, CA (US);

Gregory Whiting, Menlo Park, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/56 (2006.01); C23C 14/04 (2006.01); C23C 14/54 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
C23C 14/562 (2013.01); C23C 14/042 (2013.01); C23C 14/54 (2013.01); C23C 14/56 (2013.01); C23C 14/5873 (2013.01);
Abstract

A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate.


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