The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Mar. 29, 2019
Applicant:

Stathera Ip Holdings Inc., Montreal, CA;

Inventors:

Vamsy Chodavarapu, Brossard, CA;

George Xereas, Montreal, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H03H 3/007 (2006.01); H03H 9/24 (2006.01); B81B 7/00 (2006.01); G01L 9/12 (2006.01); H03H 9/05 (2006.01); G01L 9/00 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00182 (2013.01); B81B 7/007 (2013.01); B81C 1/00269 (2013.01); B81C 1/00301 (2013.01); G01L 9/0042 (2013.01); G01L 9/0073 (2013.01); G01L 9/12 (2013.01); H03H 3/0072 (2013.01); H03H 3/0073 (2013.01); H03H 9/0561 (2013.01); H03H 9/1057 (2013.01); H03H 9/2405 (2013.01); H03H 9/2426 (2013.01); H03H 9/2431 (2013.01); H03H 9/2436 (2013.01); B81B 2203/0307 (2013.01); H03H 9/2452 (2013.01); H03H 9/2463 (2013.01); H03H 9/2473 (2013.01); H03H 9/2478 (2013.01); H03H 2009/2442 (2013.01);
Abstract

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.


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