The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Jun. 17, 2020
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Christopher Douglas Atwood, Rochester, NY (US);

Erwin Ruiz, Rochester, NY (US);

David M. Kerxhalli, Rochester, NY (US);

Douglas K. Herrmann, Webster, NY (US);

Linn C. Hoover, Webster, NY (US);

Derek A. Bryl, Webster, NY (US);

Ali R. Dergham, Fairport, NY (US);

Assignee:

XEROX CORPORATION, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); G01K 13/10 (2006.01); G01K 15/00 (2006.01); B33Y 50/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/188 (2017.01); B33Y 10/00 (2015.01); B29C 64/386 (2017.01); B22F 10/85 (2021.01); G01K 7/08 (2006.01); B22F 12/10 (2021.01); B22F 12/20 (2021.01); B22F 12/90 (2021.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 10/85 (2021.01); B29C 64/188 (2017.08); B29C 64/386 (2017.08); B33Y 10/00 (2014.12); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12); G01K 7/08 (2013.01); G01K 13/10 (2013.01); G01K 15/005 (2013.01); B22F 12/10 (2021.01); B22F 12/20 (2021.01); B22F 12/90 (2021.01); B33Y 30/00 (2014.12);
Abstract

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.


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