The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Aug. 09, 2019
Applicant:
Honda Motor Co., Ltd., Tokyo, JP;
Inventors:
Chad Wojniak, Westerville, OH (US);
Kaoru Tokita, Dublin, OH (US);
Takeshi Kuriyama, Dublin, OH (US);
Kazuhisa Fujiwara, Utsunomiya, JP;
Atsushi Ban, Utsunomiya, JP;
Naoki Yoshimura, Dublin, OH (US);
Assignee:
HONDA MOTOR CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/16 (2006.01); B29C 45/26 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0055 (2013.01); B29C 45/16 (2013.01); B29C 45/2669 (2013.01); B29C 45/0081 (2013.01); B29C 2793/0009 (2013.01); B29L 2031/3005 (2013.01); B29L 2031/3008 (2013.01);
Abstract
A mold, system and method for manufacturing a part includes injection molding a substrate in a single injection mold and optionally trimming the panel substrate. The substrate can have a first configuration or a second, different configuration. Trimming of the substrate can occur when the substrate has the first configuration to define an aperture in the substrate.