The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Feb. 22, 2019
Applied Materials, Inc., Santa Clara, CA (US);
Nicholas Alexander Wiswell, San Jose, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Methods and apparatus for monitoring and controlling relative concentrations of polishing fluid additives and, or, the distribution of a polishing fluid and, or, polishing fluid additives across the surface of a polishing pad during chemical mechanical planarization (CMP) of a substrate are provided herein. In one embodiment, a method for polishing a substrate includes delivering a polishing fluid to one or more locations on a polishing surface of a polishing pad, wherein the polishing fluid comprises an optical marker; detecting optical information at a plurality of locations across a scan region of the polishing surface using an optical sensor facing theretowards; communicating the optical information to a system controller; determining a polishing fluid distribution across the scan region using the optical information; and changing an aspect of the delivery of the polishing fluid based on the polishing fluid distribution.