The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Oct. 23, 2019
Applicant:

Microjet Technology Co., Ltd., Hsinchu, TW;

Inventors:

Hao-Jan Mou, Hsinchu, TW;

Rong-Ho Yu, Hsinchu, TW;

Cheng-Ming Chang, Hsinchu, TW;

Hsien-Chung Tai, Hsinchu, TW;

Wen-Hsiung Liao, Hsinchu, TW;

Chi-Feng Huang, Hsinchu, TW;

Yung-Lung Han, Hsinchu, TW;

Chun-Yi Kuo, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); F04B 43/04 (2006.01); F16K 99/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502738 (2013.01); B01L 3/502715 (2013.01); F04B 43/046 (2013.01); F16K 99/0048 (2013.01); F16K 99/0051 (2013.01); B01L 3/502707 (2013.01); B01L 2300/0887 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B81B 2203/0338 (2013.01); F16K 2099/008 (2013.01); F16K 2099/0074 (2013.01);
Abstract

A micro channel structure includes a substrate, a supporting layer, a valve layer, a second insulation layer, a vibration layer and a bonding-pad layer. A flow channel is formed on the substrate. A conductive part and a movable part are formed on the supporting layer and the valve layer, respectively. A first chamber is formed at the interior of a base part and communicates to the hollow aperture. A supporting part is formed on the second insulation layer. A second chamber is formed at the interior of the supporting layer and communicates to the first chamber through the hollow aperture. A suspension part is formed on the vibration layer. By providing driving power sources having different phases to the bonding-pad layer, the suspension part moves upwardly and downwardly, and a relative displacement is generated between the movable part and the conductive part, to achieve fluid transportation.


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