The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Aug. 29, 2014
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Satoru Furuyama, Osaka, JP;

Masaaki Mori, Osaka, JP;

Yuichi Abe, Osaka, JP;

Keiko Fujiwara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/22 (2006.01); B01D 69/12 (2006.01); B32B 3/26 (2006.01); H05K 5/02 (2006.01); H04R 1/08 (2006.01); B32B 3/04 (2006.01); H04R 1/02 (2006.01); B01D 67/00 (2006.01); B01D 71/48 (2006.01); B01D 69/10 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
B01D 69/12 (2013.01); B01D 67/0032 (2013.01); B01D 67/0088 (2013.01); B01D 69/10 (2013.01); B01D 71/48 (2013.01); B32B 3/04 (2013.01); B32B 3/266 (2013.01); B32B 27/06 (2013.01); H04R 1/023 (2013.01); H04R 1/086 (2013.01); H05K 5/0213 (2013.01); B01D 2325/38 (2013.01); B32B 2307/10 (2013.01); B32B 2307/724 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/73 (2013.01); B32B 2457/00 (2013.01); H04R 2499/11 (2013.01);
Abstract

Provided is a waterproof gas-permeable membrane () having higher levels of both gas permeability and waterproofness than conventional ones. The waterproof gas-permeable membrane () includes: a non-porous resin film () having through holes (to) formed to extend through the thickness of the resin film (); and a liquid-repellent layer () formed on a principal surface of the resin film () and having openings () positioned in register with the through holes (to). The through holes (to) extend straight and have a diameter of 15 μm or less. The through holes (to) are distributed at a hole density of 1×10holes/cmor more and 1×10holes/cmor less in the resin film (). The through holes (to) extend in oblique directions with respect to a direction perpendicular to the principal surface of the resin film (). The through holes (to) that extend in different oblique directions are present together.


Find Patent Forward Citations

Loading…