The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Jun. 27, 2017
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Youhei Suganuma, Chiba, JP;

Kazumi Oi, Chiba, JP;

Tsugio Tomura, Chiba, JP;

Makoto Kimura, Chiba, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/22 (2006.01); B01D 63/02 (2006.01); B41J 2/19 (2006.01); C08G 59/32 (2006.01); B41J 2/175 (2006.01); B01D 63/00 (2006.01); B01D 19/00 (2006.01);
U.S. Cl.
CPC ...
B01D 63/021 (2013.01); B01D 19/00 (2013.01); B01D 19/0031 (2013.01); B01D 63/00 (2013.01); B01D 63/02 (2013.01); B41J 2/175 (2013.01); B41J 2/19 (2013.01); C08G 59/32 (2013.01); B01D 2313/04 (2013.01); B01D 2313/20 (2013.01); B01D 2313/21 (2013.01);
Abstract

Provided is a hollow fiber membrane module that exhibits excellent durability even when a chemical such as a radical polymerizable compound is used for a separation or mixing process. Also provided is a method for producing the hollow fiber membrane module in a highly productive manner. More specifically, there is provided a hollow fiber membrane module at least including a tubular body, a cap, a hollow fiber membrane, and an end seal portion, wherein at least a liquid contacting portion of the end seal portion is sealed with a cured product of a curable resin composition including an epoxy resin, and wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of an aromatic compound containing a phenolic hydroxyl group and an aromatic compound containing a formyl group and a phenolic hydroxyl group, and there is provided a method for producing the module.


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