The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Apr. 03, 2019
Applicant:
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Inventors:
Takuma Hitotsumatsu, Shiga, JP;
Hideki Kashihara, Shiga, JP;
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); H05K 3/36 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); C08G 73/10 (2006.01); C09D 5/34 (2006.01); C09D 179/08 (2006.01); C09J 179/08 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 3/207 (2013.01); H05K 3/287 (2013.01);
Abstract
According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.