The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Oct. 31, 2019
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Takayuki Naono, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 17/02 (2006.01); H01L 41/053 (2006.01); H01L 41/113 (2006.01); H04R 1/06 (2006.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); H01L 41/053 (2013.01); H01L 41/113 (2013.01); H04R 1/06 (2013.01);
Abstract

The piezoelectric microphone chip includes a single thin plate, a diaphragm support structure that is provided on one surface of the thin plate and includes an outer edge support portion that supports an outer edge of the thin plate and a separation support portion that separates the thin plate into a plurality of diaphragms in association with the outer edge support portion, a single or a plurality of piezoelectric conversion portions formed by laminating a first electrode, a piezoelectric film, and a second electrode sequentially from a diaphragm side on each of the diaphragms, and a signal detection circuit that detects outputs from the piezoelectric conversion portions provided on the plurality of diaphragms, and a relationship among a thickness tof the outer edge support portion, a thickness tof the separation support portion, and a thickness td of the thin plateis set to 13.3×td<t<t−20 μm.


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