The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Apr. 09, 2021
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Lalit Anil Palve, Seattle, WA (US);

Rhishikesh A. Sathe, Bothell, WA (US);

Andrew D. Delano, Woodinville, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G03B 17/55 (2021.01); G03B 17/56 (2021.01); H05K 7/20 (2006.01); G06F 1/16 (2006.01); F16B 1/00 (2006.01); F16M 13/02 (2006.01);
U.S. Cl.
CPC ...
H04N 5/22521 (2018.08); G03B 17/55 (2013.01); G03B 17/561 (2013.01); G03B 17/566 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H05K 7/2039 (2013.01); F16B 2001/0035 (2013.01); F16M 13/02 (2013.01); F16M 2200/08 (2013.01); G06F 1/1605 (2013.01); G06F 1/1607 (2013.01);
Abstract

Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.


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