The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Aug. 14, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Seung Wook Park, Suwon-si, KR;
Tae Kyung Lee, Suwon-si, KR;
Seong Hun Na, Suwon-si, KR;
Jae Chang Lee, Suwon-si, KR;
Jae Hyun Jung, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/05 (2006.01); H01L 41/09 (2006.01); H01L 41/053 (2006.01); H03H 3/02 (2006.01); H03H 9/60 (2006.01); H01L 41/047 (2006.01); H03H 9/17 (2006.01); H03H 9/58 (2006.01); H03H 9/02 (2006.01); H01L 41/332 (2013.01);
U.S. Cl.
CPC ...
H03H 9/1007 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/0973 (2013.01); H03H 3/02 (2013.01); H03H 9/0514 (2013.01); H03H 9/0542 (2013.01); H03H 9/174 (2013.01); H03H 9/588 (2013.01); H03H 9/605 (2013.01); H01L 41/332 (2013.01); H03H 9/02086 (2013.01); H03H 2003/023 (2013.01);
Abstract
A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.