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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11476832 B1

PDFFull Text
Date of Patent:
Oct. 18, 2022

Filed:

Aug. 14, 2019

Bulk-acoustic resonator module

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Wook Park, Suwon-si, KR;

Tae Kyung Lee, Suwon-si, KR;

Seong Hun Na, Suwon-si, KR;

Jae Chang Lee, Suwon-si, KR;

Jae Hyun Jung, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Joseph Chang

Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/05 (2006.01); H01L 41/09 (2006.01); H01L 41/053 (2006.01); H03H 3/02 (2006.01); H03H 9/60 (2006.01); H01L 41/047 (2006.01); H03H 9/17 (2006.01); H03H 9/58 (2006.01); H03H 9/02 (2006.01); H01L 41/332 (2013.01);
U.S. Cl.
CPC ...
H03H 9/1007 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/0973 (2013.01); H03H 3/02 (2013.01); H03H 9/0514 (2013.01); H03H 9/0542 (2013.01); H03H 9/174 (2013.01); H03H 9/588 (2013.01); H03H 9/605 (2013.01); H01L 41/332 (2013.01); H03H 9/02086 (2013.01); H03H 2003/023 (2013.01);
Abstract

A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.

Find Patent Forward Citations

Park, Seung. (2022). Bulk-acoustic resonator module (U.S. Patent No. 11476832). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11476832

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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