The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

May. 23, 2014
Applicant:

Qorvo Biotechnologies, Llc, Plymouth, MN (US);

Inventors:

John Mark Tischer, Waseca, MN (US);

Christopher Jennings Madsen, Waseca, MN (US);

Roger Paul Mann, Waseca, MN (US);

Assignee:

Qorvo Biotechnologies, LLC, Plymouth, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/72 (2011.01); G01N 29/02 (2006.01); G01N 29/30 (2006.01); G01N 29/22 (2006.01); H05K 1/11 (2006.01); G01N 29/036 (2006.01); G01N 33/543 (2006.01); H01L 41/08 (2006.01); H03H 9/54 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); G01N 29/022 (2013.01); G01N 29/036 (2013.01); G01N 29/222 (2013.01); G01N 29/30 (2013.01); G01N 33/54373 (2013.01); H01L 41/081 (2013.01); H01L 41/0825 (2013.01); H03H 9/54 (2013.01); H05K 1/118 (2013.01); G01N 2291/014 (2013.01); G01N 2291/022 (2013.01); G01N 2291/0255 (2013.01); G01N 2291/0256 (2013.01); G01N 2291/0426 (2013.01); H05K 1/184 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10068 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.


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