The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Feb. 20, 2020
Applicant:

Qian Jun Technology Ltd., Zhubei, TW;

Inventors:

Chi-Shen Lee, Zhubei, TW;

Yu-Yen Fu, Zhubei, TW;

Po-Chun Yeh, Zhubei, TW;

Dong-Fu Chen, Zhubei, TW;

Chih-Wen Cheng, Zhubei, TW;

Chi-Lin Huang, Zhubei, TW;

Yu-Ping Yen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/113 (2006.01); H01L 41/23 (2013.01); H01L 41/25 (2013.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); H01L 41/1132 (2013.01); H01L 41/23 (2013.01); H01L 41/25 (2013.01);
Abstract

An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.


Find Patent Forward Citations

Loading…