The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Jan. 19, 2021
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Yosuke Kajiwara, Yokohama, JP;

Aya Shindome, Yokohama, JP;

Masahiko Kuraguchi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/43 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/778 (2013.01); H01L 29/2003 (2013.01); H01L 29/432 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes first to third electrodes, first and second semiconductor layers, and an insulating member. The third electrode in a first direction is between the first and second electrodes in the first direction. The first direction is from the first toward second electrode. The first semiconductor layer includes AlGaN (0≤x1<1), and first to sixth partial regions. A second direction from the first partial region toward the first electrode crosses the first direction. The second semiconductor layer includes AlGaN (0<x2<1 and x1<x2), and first and second semiconductor regions. A direction from the fourth partial region toward the first semiconductor region is along the second direction. A direction toward the second semiconductor region from the fifth and sixth partial regions is along the second direction. The insulating member includes first to third insulating regions.


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