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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11476239 B1

PDFFull Text
Date of Patent:
Oct. 18, 2022

Filed:

Oct. 16, 2020

Light emitting structure

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

John A. Higginson, Santa Clara, CA (US);

Andreas Bibi, Los Altos, CA (US);

Hsin-Hua Hu, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:

Aikin & Gallant, LLP

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/44 (2010.01); H01L 23/31 (2006.01); H01L 33/06 (2010.01); H01L 33/00 (2010.01); H01L 33/42 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 25/00 (2006.01); H01L 33/54 (2010.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/3171 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 27/1214 (2013.01); H01L 27/1248 (2013.01); H01L 27/1262 (2013.01); H01L 33/005 (2013.01); H01L 33/06 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 21/56 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Find Patent Forward Citations

Higginson, John. (2022). Light emitting structure (U.S. Patent No. 11476239). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11476239

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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