The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Jul. 18, 2019
Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventor:

Chikara Miyazaki, Mie, JP;

Assignee:

Kioxia Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/008 (2013.01); B23K 1/20 (2013.01); B23K 2101/40 (2018.08); H01L 2224/8121 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/81091 (2013.01); H01L 2224/81815 (2013.01);
Abstract

According to an embodiment, a temperature of an inside of a furnace is set to fall within a range of a reduction temperature or more of a carboxylic acid and less than a melting temperature of a solder bump, and the inside is concurrently set to have a first carboxylic acid gas concentration. Thereafter, the temperature of the inside is raised up to the melting temperature, and the inside is concurrently set to have a second carboxylic acid gas concentration. The second carboxylic acid gas concentration is lower than the first carboxylic acid gas concentration, and is a concentration containing a minimum amount of carboxylic acid gas defined to achieve reduction on an oxide film of the solder bump. The inside has the second carboxylic acid gas concentration at least at a time when the temperature of the inside reaches the melting temperature.


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Miyazaki, Chikara. (2022). Semiconductor device manufacturing method (U.S. Patent No. 11476229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11476229

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