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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11476226 B1

PDFFull Text
Date of Patent:
Oct. 18, 2022

Filed:

Dec. 26, 2019

Radio-frequency module and communication device

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takanori Uejima, Kyoto, JP;

Yuji Takematsu, Kyoto, JP;

Naoya Matsumoto, Kyoto, JP;

Shou Matsumoto, Kyoto, JP;

Tetsuro Harada, Kyoto, JP;

Dai Nakagawa, Kyoto, JP;

Yutaka Sasaki, Kyoto, JP;

Yuuki Fukuda, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Gennadiy Tsvey

Int. Cl.
CPC ...
H03F 1/56 (2006.01); H04B 1/40 (2015.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H03F 3/68 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/3121 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 25/18 (2013.01); H03F 1/565 (2013.01); H03F 3/245 (2013.01); H03F 3/68 (2013.01); H04B 1/40 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/14215 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/165 (2013.01); H03F 2200/171 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01);
Abstract

A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.

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