The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

May. 08, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kensuke Takeuchi, Tokyo, JP;

Takashi Nagao, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/4952 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 24/37 (2013.01); H01L 24/48 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48247 (2013.01);
Abstract

In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module.


Find Patent Forward Citations

Loading…