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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11476217 B1

PDFFull Text
Date of Patent:
Oct. 18, 2022

Filed:

Mar. 10, 2020

Method of manufacturing an augmented led array assembly

Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Michael Deckers, Aachen, DE;

Tze Yang Hin, San Jose, CA (US);

Ronald Bonne, San Jose, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:

Volpe Koenig

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
G02F 1/1345 (2006.01); H01L 23/52 (2006.01); H01L 21/50 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H01L 27/02 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/49816 (2013.01); H01L 25/0753 (2013.01); H01L 27/0248 (2013.01); H01L 27/156 (2013.01); H01L 2924/14 (2013.01);
Abstract

A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

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