The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Apr. 29, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jae Hoon Choi, Suwon-si, KR;
Doo Hwan Lee, Suwon-si, KR;
Joo Young Choi, Suwon-si, KR;
Sung Han, Suwon-si, KR;
Byung Ho Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.