The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Jun. 03, 2019
Material Concept, Inc., Sendai, JP;
Junichi Koike, Miyagi, JP;
MATERIAL CONCEPT, INC., Sendai, JP;
Abstract
To provide a wiring material which does not require a diffusion barrier layer and exhibits excellent conductivity and adhesion property between a conductor and an insulator and a semiconductor element using the same. The wiring structure of the present invention includes a conductor containing an intermetallic compound and an insulator layer. The intermetallic compound preferably contains two or more kinds of metal elements selected from the group consisting of Al, Fe, Co, Ni, and Zn. In addition, the intermetallic compound is preferably one or more kinds selected from an intermetallic compound containing Al and Co, an intermetallic compound containing Al and Fe, an intermetallic compound containing Al and Ni, an intermetallic compound containing Co and Fe, or an intermetallic compound containing Ni and Zn.