The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Oct. 25, 2016
Applicant:
Tesla, Inc., Austin, TX (US);
Inventors:
Wenjun Liu, Santa Clara, CA (US);
Robert James Ramm, Mountain View, CA (US);
Alan David Tepe, Fremont, CA (US);
Colin Kenneth Campbell, San Francisco, CA (US);
Dino Sasaridis, San Francisco, CA (US);
Assignee:
Tesla, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/07 (2006.01); H01L 23/532 (2006.01); H02M 7/537 (2006.01); H02M 7/00 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 29/78 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/53238 (2013.01); H01L 24/75 (2013.01); H01L 27/0711 (2013.01); H01L 27/0727 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H01L 23/3677 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/074 (2013.01); H01L 25/115 (2013.01); H01L 25/117 (2013.01); H01L 25/18 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/7395 (2013.01); H01L 29/78 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/753 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.