The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Sep. 18, 2019
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Shingo Mori, Yamaga, JP;

Ryota Minowa, Yamaga, JP;

Yasuo Hayashida, Kumamoto, JP;

Naoki Kawaguchi, Yame, JP;

Kohei Otsuka, Omuta, JP;

Hiroyuki Iwasaka, Kamimashiki, JP;

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 50/12 (2006.01); H01H 50/02 (2006.01); H01H 50/36 (2006.01); H01H 50/54 (2006.01);
U.S. Cl.
CPC ...
H01H 50/12 (2013.01); H01H 50/02 (2013.01); H01H 50/36 (2013.01); H01H 50/54 (2013.01);
Abstract

An electromagnetic relay includes a fixed terminal, a movable contact piece, a housing, and a heat dissipation structure. The fixed terminal includes a first surface, a second surface opposite the first surface, and a fixed contact disposed on the first surface. The movable contact piece includes a movable contact that is configured to contact the fixed contact. The housing includes an accommodation space accommodating a portion of the fixed terminal, the fixed contact, and the movable contact piece. The heat dissipation structure includes a heat dissipation space that is provided on the second surface of the fixed terminal for dissipating the heat of the fixed terminal to an outside of the accommodation space.


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