The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Jul. 02, 2021
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Yasuhiro Nishisaka, Nagaokakyo, JP;
Mitsuru Ikeda, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component includes external nickel layers each provided on end surfaces of a multilayer body and external copper electrode layers each covering the end surfaces on which the external nickel layers are provided. When a dimension of each of the external nickel layers in the lamination direction is defined as TN, and a dimension of the inner layer portion in the lamination direction is defined as T1, T1<TN is satisfied. When a dimension of each of the external nickel layers in the width direction is defined as WN and a dimension of the inner layer portion in the width direction is defined as W1, a relationship of WN<W1 is satisfied, and a relationship of WN<TN is satisfied. The inner layer portion includes at least one uncovered region. The internal and external nickel electrode layers are directly bonded in the uncovered region.