The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Feb. 01, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Masanori Suzuki, Tokyo, JP;

Manabu Yamatani, Tokyo, JP;

Takuya Takeuchi, Tokyo, JP;

Ikuya Kokubo, Tokyo, JP;

Tomonaga Nishikawa, Tokyo, JP;

Naoaki Fujii, Tokyo, JP;

Nobuya Takahashi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H01F 27/24 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 41/127 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component is provided with a coil part in which a plurality of conductor layers and a plurality of interlayer insulating layers are alternately laminated; and a sealing resin layer that covers the coil part. The conductor layers each include a spiral pattern. The interlayer insulating layers each cover an upper surface and a side surface of the spiral pattern. The recessed part is formed in the side wall surface of the interlayer insulating layer. A part of the sealing resin layer is embedded in the recessed part.


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