The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Feb. 26, 2018
Applicant:

National Institute for Materials Science, Ibaraki, JP;

Inventors:

Nobuya Banno, Ibaraki, JP;

Kyoji Tachikawa, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/10 (2006.01); C22C 9/01 (2006.01); C22C 9/04 (2006.01); C22C 13/00 (2006.01); C22C 27/02 (2006.01); C22F 1/08 (2006.01); C22C 9/00 (2006.01); C22F 1/18 (2006.01); H01L 39/24 (2006.01); C22F 1/16 (2006.01);
U.S. Cl.
CPC ...
H01B 12/10 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/04 (2013.01); C22C 13/00 (2013.01); C22C 27/02 (2013.01); C22F 1/08 (2013.01); C22F 1/16 (2013.01); C22F 1/18 (2013.01); H01L 39/2409 (2013.01); Y10T 428/12708 (2015.01); Y10T 428/12819 (2015.01); Y10T 428/12903 (2015.01);
Abstract

In the production of an internal-tin-processed NbSn superconducting wire, the present invention provides a NbSn superconducting wire that is abundant in functionality, such as, the promotion of formation of a NbSn layer, the mechanical strength of the superconducting filament (and an increase in interface resistance), the higher critical temperature (magnetic field), and the grain size reduction, and a method for producing it. A method for producing a NbSn superconducting wire according to an embodiment of the present invention includes a step of providing a barthat has a Sn insertion holeprovided in a central portion of the barand a plurality of Nb insertion holesprovided discretely along an outer peripheral surface of the Sn insertion hole, and that has an alloy composition being Cu-xZn-yM (x: 0.1 to 40 mass %, M=Ge, Ga, Mg, or Al, provided that, for Mg, x: 0 to 40 mass %), a step of mounting an alloy bar with an alloy composition of Sn-zQ (Q=Ti, Zr, or Hf) into the Sn insertion holeand inserting Nb cores into the Nb insertion holes, a step of subjecting the barto diameter reduction processing to fabricate a Cu-xZn-yM/Nb/Sn-zQ composite multicore wire with a prescribed outer diameter, and a step of subjecting the composite multicore wire to NbSn phase generation heat treatment.


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