The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Dec. 27, 2017
Applicant:

Wuhan University of Science and Technology, Hubei, CN;

Inventors:

Weigang Li, Hubei, CN;

Ken Deng, Hubei, CN;

Wei Yang, Hubei, CN;

Chao Liu, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 5/02 (2006.01); B21B 1/22 (2006.01); G06F 113/24 (2020.01); C21D 7/13 (2006.01); G06N 7/00 (2006.01); G06N 5/00 (2006.01);
U.S. Cl.
CPC ...
G06N 5/022 (2013.01); B21B 1/22 (2013.01); B21B 2001/225 (2013.01); C21D 7/13 (2013.01); G06F 2113/24 (2020.01); G06N 5/003 (2013.01); G06N 7/005 (2013.01);
Abstract

The present invention provides a microalloyed steel mechanical property prediction method based on globally additive model, including the following steps: determining some influencing factors of the microalloyed steel mechanical property prediction model; calculating the components and contents of carbonitride precipitation in a microalloyed steel rolling process; expressing the microalloyed steel mechanical property prediction model as an additive form of several submodels according to generalized additive model; estimating the microalloyed steel mechanical property prediction model; and verifying reliability of the submodels. The microalloyed steel property prediction models obtained in the foregoing solution have advantages such as high prediction precision and a wide adaptation range, and may be used for design of new products and steel grade component optimization, so as to reduce the quantity of physical tests, shorten the product research and development cycle, and reduce costs.


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