The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Dec. 18, 2020
Applicant:

Japan Display Inc., Minato-ku, JP;

Inventors:

Yohei Yamaguchi, Tokyo, JP;

Arichika Ishida, Tokyo, JP;

Hidekazu Miyake, Tokyo, JP;

Hiroto Miyake, Tokyo, JP;

Isao Suzumura, Tokyo, JP;

Assignee:

Japan Display Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1368 (2006.01); G02F 1/1362 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); G02F 1/1343 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/134309 (2013.01); G02F 1/136209 (2013.01); G02F 1/136227 (2013.01); H01L 27/1225 (2013.01); H01L 29/7869 (2013.01); H01L 29/78633 (2013.01); G02F 1/13685 (2021.01); G02F 1/136218 (2021.01); G02F 2202/10 (2013.01); H01L 29/42384 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.


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