The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Jan. 29, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Nicolas Degrenne, Rennes, FR;
Guilherme Bueno Mariani, Rennes, FR;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degr); estimating an estimated indicator of degradation (Degr) by a temporal degradation model; obtaining a set of on-line measure (X); then, (1) converting the on-line measure (X) into a deducted indicator of degradation (Degr) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degr; Degr); and/or (1) converting the estimated indicator of degradation (Degr) into a set of on-line estimation (X), and (2) computing a deviation between set of on-line measure and estimation (X; X); and correcting the estimated indicator of degradation (Degr) into a corrected estimated indicator of degradation (Degr) as a function of the computed deviation.