The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Apr. 17, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Hiroshi Matsubara, Nagaokakyo, JP;

Junko Izumitani, Nagaokakyo, JP;

Hideaki Ooe, Nagaokakyo, JP;

Masutaro Nemoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); G01N 27/16 (2006.01); H01L 21/265 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/16 (2013.01); H01L 21/02172 (2013.01); H01L 21/02203 (2013.01); H01L 21/02258 (2013.01); H01L 21/265 (2013.01); H01L 28/40 (2013.01);
Abstract

A semiconductor device that includes a semiconductor substrate having a first main surface and a second main surface opposed to each other, and a porous metal oxide film on a side of the first main surface of the semiconductor substrate, the porous metal oxide film having a plurality of pores. The semiconductor substrate has a connection electrically connected to the porous metal oxide film, and the semiconductor substrate is configured to provide a power supply path from the second main surface to the connection on the first main surface.


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