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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11472992 B1

PDFFull Text
Date of Patent:
Oct. 18, 2022

Filed:

Nov. 15, 2018

Polymer matrix composites comprising thermally conductive particles and methods of making the same

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Derek J. Dehn, Maplewood, MN (US);

Clinton P. Waller, Jr., White Bear Lake, MN (US);

Bharat R. Acharya, Woodbury, MN (US);

Brandon A. Bartling, Woodbury, MN (US);

Audrey S. Forticaux, Minneapolis, MN (US);

Jeremy M. Higgins, Roseville, MN (US);

Satinder K. Nayar, Woodbury, MN (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorney:
Primary Examiner:

Jane L Stanley

Int. Cl.
CPC ...
C09K 5/14 (2006.01); B29C 41/00 (2006.01); B29C 41/46 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 3/38 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B29C 41/003 (2013.01); B29C 41/46 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); B29K 2101/12 (2013.01); B29K 2995/0013 (2013.01); C08K 2003/085 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

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