The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Apr. 11, 2018
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Shuhei Yamaguchi, Osaka, JP;
Ayane Nakaue, Osaka, JP;
Masaji Komori, Osaka, JP;
Hideki Kono, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/16 (2006.01); B29C 45/00 (2006.01); B29C 49/00 (2006.01); C08L 27/18 (2006.01); C08L 33/12 (2006.01);
U.S. Cl.
CPC ...
C08L 27/16 (2013.01); B29C 45/00 (2013.01); B29C 49/00 (2013.01); C08L 27/18 (2013.01); C08L 33/12 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01);
Abstract
A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.