The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Jun. 27, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Keiichi Sekiguchi, Satsumasendai, JP;
Takeshi Muneishi, Kusatsu, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
C04B 37/023 (2013.01); C04B 2237/125 (2013.01);
Abstract
In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).