The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Jul. 31, 2019
Nitto Denko Corporation, Ibaraki, JP;
Shunji Imamura, Ibaraki, JP;
Shimpei Yakuwa, Ibaraki, JP;
Kou Uemura, Ibaraki, JP;
Tomoyuki Kasagi, Ibaraki, JP;
Yuya Kitagawa, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
A plate-like composite material in which peeling of a conductor layer and the like serving as wiring is less liable to occur is provided. The plate-like composite material includes: a pore-containing layer, which contains a fluororesin and a filler, and which contains pores; and a resin layer containing a fluororesin bonded to one surface, or each of both surfaces, of the pore-containing layer, wherein the pore-containing layer includes, in a vicinity of an interface with the resin layer, a high resin content region, which contains the fluororesin in a content higher than a content in a remaining region of the pore-containing layer, and which contains the pores in a content lower than a content in the remaining region, and wherein the high resin content region has a thickness starting from the interface of from 0.20 μm to 10 μm.