The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Dec. 11, 2019
Applicant:

The Clorox Company, Oakland, CA (US);

Inventors:

Nikhil P. Dani, Pleasanton, CA (US);

Joerg Hendrix, Kennesaw, GA (US);

Scott Wood, Pleasanton, CA (US);

Hubert Chan, Pleasanton, CA (US);

Daniela Fritter, Pleasanton, CA (US);

Assignee:

The Clorox Company, Oakland, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 23/02 (2006.01); B32B 5/02 (2006.01); B32B 27/32 (2006.01); B32B 27/12 (2006.01); B32B 7/12 (2006.01); B32B 27/10 (2006.01); C11D 17/04 (2006.01); C11D 3/30 (2006.01); B08B 1/00 (2006.01); B32B 29/00 (2006.01); D21F 11/00 (2006.01); D21F 11/14 (2006.01); D21H 13/14 (2006.01); D21H 27/00 (2006.01); D21H 27/02 (2006.01); D21H 27/36 (2006.01); A47L 13/17 (2006.01);
U.S. Cl.
CPC ...
B32B 23/02 (2013.01); B08B 1/006 (2013.01); B32B 5/022 (2013.01); B32B 7/12 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 29/002 (2013.01); C11D 3/30 (2013.01); C11D 17/041 (2013.01); D21F 11/006 (2013.01); D21F 11/14 (2013.01); D21H 13/14 (2013.01); D21H 27/002 (2013.01); D21H 27/02 (2013.01); D21H 27/36 (2013.01); A47L 13/17 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2260/04 (2013.01); B32B 2262/062 (2013.01); B32B 2274/00 (2013.01); B32B 2307/724 (2013.01); B32B 2307/728 (2013.01); B32B 2367/00 (2013.01); B32B 2432/00 (2013.01); Y10T 428/3188 (2015.04); Y10T 428/31855 (2015.04);
Abstract

Multi-layer substrates comprising top and bottom surface layers comprised of synthetic nonwoven fibers, and a melted thermoplastic material layer between the top and bottom layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the top and bottom surface layers that are in contact with the thermoplastic material as it melts.


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