The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Sep. 15, 2017
Applicant:

Covestro Deutschland Ag, Leverkusen, DE;

Inventors:

Dirk Achten, Leverkusen, DE;

Thomas Büsgen, Leverkusen, DE;

Dirk Dijkstra, Odenthal, DE;

Bettina Mettmann, Dormagen, DE;

Levent Akbas, Witten, DE;

Roland Wagner, Leverkusen, DE;

Michael Kessler, Cologne, DE;

Assignee:

Covestro Deutschland AG, Leverkusen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B29C 64/165 (2017.01); B33Y 80/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/124 (2017.01); B29C 64/245 (2017.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); B29B 9/02 (2006.01); B29K 7/00 (2006.01); B29K 19/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/124 (2017.08); B29C 64/165 (2017.08); B29C 64/245 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B29B 9/02 (2013.01); B29K 2007/00 (2013.01); B29K 2019/00 (2013.01); B33Y 50/02 (2014.12);
Abstract

A process is described for producing a three dimensional structure, the process including the following steps a) applying of at least a first material Monto a substrate to build a first layer Lon the substrate; b) layering of at least one further layer Lof the first material Mor of a further material Monto the first layer L, wherein the at least one further layer Ly covers the first layer Land/or previous layer Lat least partially to build a precursor of the three dimensional structure; c) curing the precursor to achieve the three dimensional structure; wherein at least one of the materials Mor Mprovides a Mooney viscosity of >10 ME at 60° C. and of <200 ME at 100° C. before curing and wherein at least one of the first material Mi or of the further material Mis a powder. Also, a three dimensional structure is described which is available according to the process according to the invention.


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