The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Oct. 02, 2017
Robert Bosch Gmbh, Stuttgart, DE;
Hendrik Jahnle, Leutenbach, DE;
Bernd Beiermeister, Steinheim-Kleinbottwar, DE;
Markus Menacher, Ingersheim, DE;
Norman Lung, Weinstadt, DE;
Victor Roman, Stuttgart, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The invention relates to a method () for establishing a connection between an inlay () and a polymer () at least partially surrounding the inlay, wherein a monomer () is brought into contact () with the inlay () and is subsequently polymerized () to form the polymer (), wherein the temperature TE of the inlay () is increased () at least briefly at least to that temperature TM that the monomer () assumes at its maximum during its exothermic polymerization () to form the polymer (), and/or that ensures that the heat flow always runs from the inlay () to the monomer (). The invention also relates to a method (), (), () for the sealing integration of an inlay () in a component (). The invention also relates to a device () for carrying out the method (), comprising a conveyor () for a lead frame () in which a multiplicity of inlays () are able to be fed, and an at least two-part () mould () which is closable about an individual inlay () and has a feed () for feeding the monomer () into the space () between the mould () and the inlay (), wherein a current supply () is provided for the resistive and/or inductive heating () of the inlay () surrounded by the mould ().