The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Sep. 25, 2020
Sodick Co., Ltd., Kanagawa, JP;
Naoto Nakamura, Kanagawa, JP;
Shuji Okazaki, Kanagawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
A lamination molding apparatus includes: a material layer forming device that forms a material layer in a molding region; an irradiator that sinters or melts the material layer to form a solidified layer; and a cooling device that cools, to a cooling temperature, at least a part including an upper surface of a solidified body. The material layer forming device includes: a base having the molding region, a recoater head disposed on the base, a recoater head driving device that reciprocates the recoater head in a horizontal direction, and a blade that is arranged on the recoater head and that levels material powder to form the material layer. The cooling device includes: a cooling body that is controlled to the cooling temperature and comes into contact with the upper surface of the solidified body, and a mounting member that mounts the cooling body to the recoater head.