The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

May. 15, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Alexander Felix Fiseni, Cologne, DE;

Matthew Harvey Krohn, Reedsville, PA (US);

Stephan Falter, Simmerath, DE;

Sven Runte, Grevenbroich, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); H05K 3/32 (2006.01); G01N 29/32 (2006.01); G01N 29/04 (2006.01); G10K 11/00 (2006.01); G01N 29/26 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0622 (2013.01); B06B 1/0607 (2013.01); G01N 29/04 (2013.01); G01N 29/262 (2013.01); G01N 29/32 (2013.01); G10K 11/002 (2013.01); H05K 3/32 (2013.01); G01N 2291/106 (2013.01);
Abstract

A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.


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