The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Oct. 26, 2018
Applicants:

Continental Teves Ag & Co. Ohg, Frankfurt am Main, DE;

Continental Automotive Gmbh, Hannover, DE;

Inventors:

Henryk Frenzel, Regensburg, DE;

Dietmar Huber, Roedermark, DE;

Jakob Schillinger, Gaimersheim, DE;

Jörg Möstl, Mainhausen, DE;

Karl-Heinz Scherf, Eppstein, DE;

Georg Weber, Egelsbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 5/00 (2006.01); H05K 13/00 (2006.01); G01R 31/364 (2019.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); H05K 5/0056 (2013.01); H05K 13/00 (2013.01); G01R 31/364 (2019.01); Y10T 29/49146 (2015.01);
Abstract

A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.


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