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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11470722 B1

PDFFull Text
Date of Patent:
Oct. 11, 2022

Filed:

Oct. 05, 2018

Current introduction terminal, and pressure holding apparatus and x-ray image sensing apparatus therewith

Applicant:

Riken, Saitama, JP;

Inventors:

Yuji Matsuda, Wako, JP;

Takashi Kameshima, Wako, JP;

Osami Sugata, Wako, JP;

Toshiaki Tosue, Wako, JP;

Assignee:

RIKEN, Saitama, JP;

Attorney:

Osha Bergman Watanabe & Burton LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01); H01L 21/02 (2006.01); H01L 21/30 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/58 (2006.01); H01L 23/02 (2006.01); H01L 23/055 (2006.01); H01L 23/06 (2006.01); H01L 23/08 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/58 (2006.01); H01L 23/62 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 41/04 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/08 (2006.01); H01L 41/18 (2006.01); H01L 41/22 (2013.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/184 (2013.01); H05K 3/4061 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A current introduction terminal includes a board made of resin. The board has a first face and a second face opposite each other. The board hermetically separates environments of different air pressures from each other. A plurality of through via holes corresponding both to a plurality of metal terminals of a first surface-mount connector to be mounted on the first face and to a plurality of metal terminals of a second surface-mount connector to be mounted on the second face are formed to penetrate between the first and second faces, and then hole parts of the through via holes are filled with resin.

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