The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Nov. 19, 2020
Applicants:

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Te Connectivity Services Gmbh, Schaffhausen, CH;

Inventors:

An Yang, Shanghai, CN;

Lvhai Hu, Shanghai, CN;

Sun Kyu Pak, Middletown, PA (US);

Roberto Francisco-Yi Lu, Bellevue, WA (US);

Yun Liu, Shanghai, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/048 (2006.01); H01R 43/058 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01R 43/058 (2013.01);
Abstract

A joint crimping apparatus adapted to crimp a joint to an end of a cable includes a base, a fixed die detachably mounted on the base, a movable die configured to reciprocate relative to the fixed die, and a separation mechanism. The fixed die has a first groove adapted to receive a portion of a joint in an un-crimped state. The movable die has a second groove adapted to cooperate with the first groove to crimp the joint to the end of the cable. The separation mechanism is configured to remove the cable jammed in the second groove and crimped with the joint from the second groove.


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