The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Apr. 23, 2021
Yazaki Corporation, Tokyo, JP;
Masanobu Higashitani, Kakegawa, JP;
Madoka Ooishi, Makinohara, JP;
Masayuki Tamano, Makinohara, JP;
Yasuhiro Tanaka, Kakegawa, JP;
Hiroki Kitagawa, Kakegawa, JP;
Yusuke Tsutagawa, Kakegawa, JP;
Masatoshi Yamada, Kakegawa, JP;
YAZAKI CORPORATION, Tokyo, JP;
Abstract
A molding method of a waterproof member is provided. The waterproof member is molded by molds and is for a coated electric wire. The molds include mold division surfaces including molding portions and electric wire mold clamping portions. The electric wire mold clamping portions are to sandwich the coated electric wire at sides of the molding portions. One of the electric wire mold clamping portions includes a convex portion and a side wall erected on an end of the convex portion. The other of the electric wire mold clamping portions includes a concave portion. One of the molding portions includes a side wall entering groove into which the side wall enters. The method includes molding the waterproof member accommodated in the concave portion with the waterproof member being pressed by the convex portion toward a direction in which one of the mold is attached to the other.