The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Jul. 30, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Hiroaki Tokuya, Nagaokakyo, JP;

Masahiro Shibata, Nagaokakyo, JP;

Akihiko Ozaki, Nagaokakyo, JP;

Satoshi Goto, Nagaokakyo, JP;

Fumio Harima, Nagaokakyo, JP;

Atsushi Kurokawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/737 (2006.01); H01L 27/082 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 27/0823 (2013.01); H01L 29/7371 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/351 (2013.01);
Abstract

At least one unit transistor is arranged over a substrate. A first wiring as a path of current that flows to each unit transistor is arranged over the at least one unit transistor. An inorganic insulation film is arranged over the first wiring. At least one first opening overlapping a partial region of the first wiring in a plan view is provided in the inorganic insulation film. An organic insulation film is arranged over the inorganic insulation film. A second wiring coupled to the first wiring through the first opening is arranged over the organic insulation film and the inorganic insulation film. In a plan view, a region in which the organic insulation film is not arranged is provided outside a region in which the first wiring is arranged. The second wiring is in contact with the inorganic insulation film outside the region in which the first wiring is arranged.


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