The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Mar. 16, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Hyunki Kim, Asan-si, KR;
Sangsoo Kim, Cheonan-si, KR;
Seung Hwan Kim, Asan-si, KR;
Kyung Suk Oh, Seongnam-si, KR;
Yongkwan Lee, Hwaseong-si, KR;
Jongho Lee, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 23/367 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 25/071 (2013.01); H01L 25/074 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01);
Abstract
Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.